Immersion Gold High Power HDI FR4 6 Layer PCB
1. 6 layer PCB.
2. FR4 High temp.
3. 1OZ inner copper and 3OZ outer copper.
4. 0.076mm line width/space.
5. High power supplier solution.
| 1 | Layers | layer |
| 2 | Material | FR4 high tg |
| 3 | PCB thick | 1.65mm |
| 4 | Applied to | High power supplier |
| 5 | Microvia | 0.12mm |
| 6 | Min line width | 0.076mm |
| 7 | Min spacing | 0.076mm |
| 8 | Surface treatment | Immersion gold |
| 9 | Cu thickness | 1OZ inner and 3OZ outer |
| 10 | Solder mask | Green |
| 11 | Blind vias | Yes |
| 12 | Buried vias | Yes |
| 13 | Pads over vias | Yes |
| 14 | Certificates | UL,RoHS compliant,ISO9001/14001,ISO/TS16949,SGS |
FAQ
Q1:How about HDI?
A: High density Interconnect.
Q2:HDI summary?
A: HDI with a higher wiring density per unit area than conventional PCB,They have finer line and space<=100um,smaller via(<=150umm) and capture pad<=400um, and higher connection paddensity(>20pads/cm2) than conventional PCB.
Q3:What about quality?
A: HDI PCB should 100% test ok before ship it.
Q4: What's your delivery?
A: For HDI PCB,20 working days production time commonly.
Q5: Where‘s your customers?
A: Europe,America,Southeast Asia etc.
Q6: How about the necessary file?
A: Gerber with drill layer.
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