Mobile Phone 8 Layer PCB HDI Circuit Boards
1. 8 layer PCB and immersion gold 2u''.
2. FR4 Tg150 material.
3. Mobile phone industry.
4. Impedance control 50ohm.
5. 0.08mm line track/spacing.
| 1 | Layer | 8 layer |
| 2 | Substrate | FR4 tg150 |
| 3 | PCB thickness | 1.0mm |
| 4 | Application | Mobile phone |
| 5 | Microvia size | 0.12mm |
| 6 | Min line copper | 0.08mm |
| 7 | Min spacing | 0.08mm |
| 8 | Surface finish | Immersion gold 2u'' |
| 9 | Cu weight | 1OZ |
| 10 | Solder mask | Green LPISM |
| 11 | Blind vias | Yes |
| 12 | Buried vias | Yes |
| 13 | Certification | UL,ISO9001/14001,ISO/TS16949,RoHS,SGS |
FAQ
Q1:HDI full name?
A: High density Interconnect.
Q2:High density Interconnect means?
A: HDI with a higher wiring density per unit area than conventional circuit boards,They have finer line and spacing<=0.1mm,smaller vias(<=0.15mm) and capture pads<=0.4mm, and higher connection pad density(>20pads/cm2) than conventional circuit boards.
Q3:What's your quality?
A: All HDI circuit board need test alright and packing security.
Q4: What's your delivery?
A: As for HDI circuit boards,the production time about 4weeks.
Q5: Application field?
A: Telecommunication such as mobile phone,Consumer electronics,Control system and so on.
Q6: Which file required?
A: Gerber file include drill chart.
PCB Examination:
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