MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine
Product Description: MH550/MH550DH/MH550DL In-line PCBA 3D Optical Inspection Equipment
Manufacturer: Shenzhen Minghao Vision Technology Co., LTD
Overview
The MH550 series is an advanced 3D optical inspection system designed for high-precision detection of solder defects and component anomalies in PCBA (Printed Circuit Board Assembly) production lines. Leveraging structured light imaging and deep learning algorithms, it delivers sub-micron measurement accuracy (≤1µm repeatability) for superior defect identification with minimal false alarms.
Key Features
| Category | Description |
|---|---|
| Technology | 3D structured light imaging + deep neural networks (DNN) for intelligent defect classification. |
| Detection Scope | Components: Missing, misaligned, flipped, skewed, damaged. Solder: Insufficient/excessive solder, bridging, voids, cold joints, tin beads (≥120µm). |
| Speed & Efficiency | 0.55 sec/FOV; supports mixed-board production with automatic program switching. |
| Imaging Resolution | 10µm/15µm (FOV: 40×30mm/60×45mm); RGB+W light source + 4-direction structured light. |
| Data & Connectivity | Barcode/QR code recognition, SPC analytics, MES integration, and remote monitoring. |
| Hardware | 12MP high-speed camera, servo-driven gear mechanism, NVIDIA GPU acceleration. |
| Customization | Configurable for PCB sizes: 50×50mm to 1200×460mm; thickness: 0.5–6mm. |
Technical Specifications
| Model | MH550 | MH550DH | MH550DL |
|---|---|---|---|
| PCB Size | 50×50mm – 510×460mm | 50×50mm – 510×600mm | 50×50mm – 1200×460mm |
| Component Height | Top/Bottom: 40mm | Top/Bottom: 40mm | Top/Bottom: 40mm |
| Resolution | 10µm @ 40×30mm FOV | 15µm @ 60×45mm FOV | 10µm/15µm configurable |
| Power | 2KVA (AC220V) | 2.5KVA (AC220V) | 2.5KVA (AC220V) |
| Weight | ~880kg | ~1100kg | ~1100kg |
Core Advantages
Ultra-High Precision
1µm repeatability with dynamic adaptive calibration.Multi-angle projection (4/8-direction) eliminates shadows and distortions.
AI-Driven Efficiency
One-click programming: Auto-detection of trained components/solder joints.SPC alarms and real-time data export for traceability.
Robust Hardware
High-rigidity structure reduces vibration during high-speed operation.GPU-accelerated algorithms (CUDA, OpenMP) for rapid 3reconstruction.
Versatile Applications
Compatible with pre-/post-reflow inspection in SMT lines. Supports bare boards and assembled devices.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.