SPI 6500 3D Solder Paste Thickness Tester Machine Powerful SPC Function
Avail of Infinite Automation's perfect solution to your Solder Paste Thickness testing. Here we are introducing our high accuracy Solder Paste Thickness Testing Machine, the INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester. This Solder Paste Thickness Testing Equipment is easy to use. INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester is designed with a user-friendly programming interface. This SPI equipment has multiple measurement methods, adjustable scanning distance, 3D image simulation function, independent 3D dynamic observer, and a powerful SPC function.
INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester
Product Function:
- Friendly programming interface.
- Multiple measurement methods
- Adjustable scanning distance
- Image of 3D simulation function
- Independent 3D dynamic observer
- Powerful SPC function
- Once built back to the screen center function
- Can measure silkscreen and copper thickness
Product Features:
- The original high-definition color camera imported from Germany is used to ensure the high precision and high stability of the test.
- It adopts a military-grade secondary laser, which is less interfered with by the light source of the external environment, and is more stable, and has a longer life.
- With flexible hardware design, light source, laser, and camera, PCB boards of different colors can be tested.
- The software analysis condition is based on the database, and the early warning function is realized according to the analysis condition, which is intuitive and easy to understand.
- Powerful report analysis function, automatically generates R-Chart, X-Bar, and automatically calculates CPK.
- Export detailed and complete SPC reports, completely avoiding all the drawbacks of handwritten reports.
- The software adopts a simple and practical concept, focusing on the high-precision design of the test, and the repetition accuracy of the calibration block reaches positive and negative
- 0.001mm.
Technical Parameters:
| PARAMETERS |
| 1. Product model: SPI-6500 |
| 2. Application range: solder paste. Red glue. BGA. FPC. CSP |
| 3. Measurement items: thickness. Area, volume, 3D shape, plane distance |
| 4. Measurement principle: laser 3-angle function method measurement automatically calculates and displays the PCB deformation or tilt angle |
| 5. Software language: Chinese/English |
| 6. Lighting source: white high-brightness LED |
| 7. Measuring light source: Red laser module Y-axis movement range: 50 mm |
| 8. Measurement method: automatic full-screen measurement. Frame selection automatic measurement. Frame selection manual measurement |
| 9. Field of view: 12mm*15mm |
| 10. Camera pixels: 3 million/field of view |
| 12. The highest resolution: 0.1um |
| 13. Scanning distance: 5 um /10 um /15 um /20 um |
| 14. Repeated measurement accuracy: height is less than plus or minus 1um, area <1%, volume <1% magnification: 50X |
| 15. Maximum measurable height: 5 mm |
| 16. The highest measurement speed: 250Profiles/s |
| 17. 3D mode: 3 different 3D simulation images of surface, line, and point, which can be zoomed and rotated |
Images:
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.

