TR7700QE S SMT AOI Machine Ultra High Precision 3D AOI Machine
TR7700QE S SMT AOI Machine Ultra High Precision 3D AOI Machine
TR7700QE-S Ultra High Precision 3D AOI, Pre-owned and Reconditioned AOI machines
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.
Features:
• Semiconductor and Packaging technology Inspection
• Ultra-High Precision Stop-and-Go 3D AOI
• Inspection of Wire Bonding and Die Bonding Defects
• Ready to Inspect in Minutes with TRI's Smart Programming
Specifications:
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 12 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 5.5 µm |
| Lighting | Multi-phase true color LED |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 12 Mpix@ 5.5 µm: 4 mm |
Inspection Performance
| Imaging Speed | 12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec 12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec Note: Depending on component distribution |
Motion Table & Control
| X-Axis Control | Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional) |
| Y-Axis Control | Dual driven ballscrew + AC-servo with Motion Controller |
| Z-Axis Control | Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution | 1 µm |
Board Handling
| Max PCB Size | 330 x330 mm* *Depending on component distribution, the vailable PCB size could be different |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm. Optional: 100 mm |
| Edge Clearance | 3 mm. Optional: 5 mm |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
| WxDxH | 1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | 920 kg |
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