ASM AD210 Plus PCB SMT Machine Automatic Die Bonding Machine

ASM AD210 Plus Automatic Die Bonding System (6” wafer handling), Original and Used Die Bonding Machine

Check out our best condition original and pre-owned ASM AD210 Plus Automatic Die Bonding System (6” wafer handling). Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM AD210 Plus Automatic Die Bonding System (6” wafer handling). Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.

AD210 Plus

Automatic Die Bonding System (6” wafer handling)

Dimensions

W x D x H

2,150 x 1,400 x 2,300 mm

Features

• High placement accuracy
• Up to 8” x 8” substrate handling
• Individual control of pick and bond process
• Patented bond head design
• UV snap curing system (option)