Highly Versatile Inline Laser PCB Depaneling Machine For Different Substrates
In Line laser PCB Depanel Machine Optional Inline or Offline
Advantages of Laser PCB depaneling/singulation
- No mechanical stress on substrates or circuits
- No tooling cost or consumables.
- Versatility – ability to change applications by simply changing settings
- Fiducial Recognition – more precise and clean cut
- Optical Recognition before PCB depaneling/singulation process begins.
- Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
- Extraordinary cut quality holding tolerances as small as < 50 microns.
- No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards
Specification:
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Specification |
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Cutting accuracy of the whole machine: 0.02mm |
humidity: ＜60% |
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size of processed products: 330*330mm/330*670 |
floor loading: 1500kgf/m2 |
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moving speed of the platform:300mm/s |
human-computer operation and data storage:industrial computer |
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processing speed of the vibration mirror: ≤50000mm/s |
size of the host computer: 1250*1300*1600 (L X H X D)mm |
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minimum processing line width : 0.0015mm |
Machine Weight: 1500 Kg |
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positioning accuracy of the platform: 0.002mm |
Equipment Source: AC220/3KW |
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operation interface: Chinese/English interface |
operating system: Windows7 |
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repeatability of the platform: 0.002mm |
processing picture file: Gerber或DXF |
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size of the dust collector: 500*650*900 (L X H X D)mm |
compensation for shrinkage and expansion: Automatic compensation of MARK points |
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ambient temperature: 20±2℃ |
dust collector: 1.5KW |
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power supply of the dust collector: AC 220V 50/60Hz |
dust collector weight: 85Kg |
More information welcome to contact us:
Email: sales@dgwill.com
Wechat/Skype:+86 18166146357
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