Laser PCB Depanelizer Machine for Neat and Smooth Edge Cutting Advantages of Laser PCB Depaneling/Singulation

• No mechanical stress on substrates or circuits
• No tooling cost or consumables.
• Versatility – ability to change applications by simply changing settings
• Fiducial Recognition – more precise and clean cut
• Optical Recognition before PCB depaneling/singulation process begins.
• Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
• Extraordinary cut quality holding tolerances as small as < 50 microns.
• No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Description:

Neat and smooth edge, no burr or overflow

Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.

Laser wavelength: 355nm

Rated power: 10W/12W/15W/18W@30KHz

Galvanometer working field Per One Process: 40 × 40mm

Power consumption for the hole machine: 2KW

Specification: