V-Cut PCB Prototype Machine 0.3mm - 3.5mm With Part Count Capacity

Ideal for thick PCBs
Can be used with aluminum , FR4, CEM3 and other substrates
Keeping pace with mid-to-large volume production 
Panelized flexible or ultra-thin PCBs
Densely populated PCBs with components located too close to the score line for standard depanelers to handle
Aluminum and metalized substrates (in addition to FR4 , CEM3 , etc . )
PCBs are separated by the CWVC-200 dual wedge-shaped knives in one gentle rocking motion that shears the panel along the score line , without stress or damage to the PCBs or components . Even when metalized circuit boards are processed – such as those populated with heat-generating LEDs that require heat-dissipating metal inner layers – this machine will easily make the cut .

Fetures :

Separates boards up to 2.0 mm thick ( with minimum 0.5 mm scoring depth )
Can be used with aluminum , FR4 , CEM3 and other substrates , including substrates with metal inner layers
Separates PCBs with components located up to 0.5 mm from the score line
Safe for use with flexible and thin PCBs
Smooth , quiet pneumatic-powered unit with foot-pedal activation
Wedge-shaped linear blades contour to v-groove score lines and operate in a rocking motion
Boards are separated without bending or breaking
No safety risks to operator since there is never a gap greater than 4 mm between the upper and lower blades
Adjust blades to PCB score line using rotary knob

Specifications :