Thermal conductive adhesive, SMT bottom filling, component packaging, solder paste, red adhesive, UV adhesive, black adhesive, semiconductor packaging, wafer fixation, and various industrial dispensing applications.

• Computer-controlled Windows operating system with fault sound and light alarm
• CCD visual positioning system for precise alignment
• Servo motor + screw drive mechanism
• Compatible with pneumatic injection, piezoelectric, screw, and AB rubber valves
• Automatic constant temperature system ensures consistent coating flowability
• Optional laser height detection for automatic Z-axis calibration
• Optional workpiece heating system enhances coating fluidity
• Optional precision weighing system for intelligent dispensing control
• Desktop design suitable for production line integration
• DIY mode with flexible axis and head configuration (1-12 heads)
• Multi-axis design with high-rigidity aluminum alloy construction
• Dual Y-axis system for automatic alternating operation
• Automatic glue feeding system for safe and quiet operation
• High-quality main components ensure reliability and accuracy

This machine is suitable for both PCB and FPC dispensing applications, capable of handling IC chips and other components underfilling and dispensing processes. It also works effectively for shell frame dispensing and coating operations.

• One-year free warranty from purchase date with lifelong maintenance
• Continuous technical updates and support services
• Lifelong free software system upgrades
• Customized technical training based on customer requirements
• Regular customer follow-up via phone and on-site visits
• Door-to-door service with one-on-one designated support policy