Pulse Heat PCB Bonding Machine with 2°C Temperature Accuracy and 1100N Bond Force for 200x260mm Working Area

Price Negotiable

Price: USD1-10000/Set

MOQ: 1 set

Delivery Time: 5-8 days

Brand: Winsmart

Product Description

Pulse Heat PCB Bonding Technology

This advanced pulse heat bonding machine utilizes innovative pulse heating technology to deliver precise temperature control for PCB soldering applications. The system employs high-resistivity thermodes (W, Mo, Ti) that rapidly heat to melt tin solder, creating reliable connections as the temperature decreases while maintaining consistent pressure throughout the process.

Key Technical Features

Fastest soldering head heating with unique pulse heat technology
Programmable temperature, heat-up rate, and time duration parameters
Precise temperature feedback control with thermocouple proximity to working surface
Closed Loop PID temperature control with LED display
Temperature-triggered programmable soldering time
Floating thermode design for consistent pressure and heat transfer
Programmable pressure switch with LCD display for precise force control
Optional CCD camera system with magnification lens for fine-pitch positioning

Technical Specifications

Parameter	Specification
Machine Dimensions	680 × 780 × 750 mm
Working Area	Maximum 200 × 260 mm
Machine Weight	135 kg
Working Air Pressure	0.4-0.6 MPa
Thermode Head Size	Maximum 80 × 5 mm
Welding Precision	Pitch 0.2 mm
Pressing Time	1-99.9 seconds
Temperature Settings	RT-500°C tolerance ±5°C
Welding Pressure	1-20 kg
Power Supply	AC220V ±10% 50HZ, 2200W