• Fully automated in-line operation saves time and reduces labor costs
• Dual static removal devices eliminate electrostatic risks on PCB surfaces
• Bilingual Chinese/English display interface for easy operation
• Draw-out design simplifies maintenance and service access
• Professional engineering with extensive industry experience

This substrate cleaning machine is specifically designed for SMT production lines, installed between the board loader and solder paste printing machine. It effectively removes board scraps, dust, fibers, hair, metal particles, and other contaminants from PCB pads before printing, preventing soldering defects and improving overall product quality.

• Specialized development for high PCB cleaning requirements
• Capable of cleaning both sides when components are mounted on PCB back
• Precision ESD anti-static device maintains voltage below 50V
• Contact cleaning method achieves over 99% cleaning efficiency
• Touch screen operation with optional Chinese/English interfaces
• Patented anti-static cleaning roller ensures stable performance
• Ideal for cleaning 0201, 01005 components and BGA, uBGA, CSP packages
• Over ten years of SMT cleaning machine design and manufacturing expertise
• Trusted by more than 100 world-renowned manufacturing facilities