Fully Automatic PCB Laser Cutting Machine for 1.6mm FR4 Boards with 15W UV Laser and ±0.003mm Accuracy

Price Negotiable

Price: USD1-150K/set

MOQ: 1 set

Delivery Time: 5-30 days

Brand: Winsmart

Product Description

Fully Automatic PCB Laser Cutting Machine for 1.6mm FR4 Printed Circuit Board

Advanced PCB Depaneling Technology

PCB depaneling and singulation laser systems are gaining popularity as circuit board complexity and component ratios continue to rise. Microelectronics and medical device manufacturers require close tolerances and minimal debris—this is where laser technology excels.

Performance Specifications

Dimensions: 1600mm × 1500mm × 1800mm (L×W×H)
Capacity UPH: Single head 1.5-2.0K (based on sample testing)
Repeat accuracy: ±0.003mm
CCD accuracy: ±0.005mm
Laser head: UV 15W
Cutting precision: ±0.03mm
Cutting yield: FR4 99.9%
Operator requirement: 1 person
Track height: 950mm ± 100mm (customizable)
Power supply: 220V/15A/50Hz, 0.5-0.7Mpa

Technical Specifications

Parameter	Specification
Laser Type	Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength	355nm
Laser Source	Optowave UV 15W@30KHz
Positioning Precision	±2μm
Repetition Precision	±1μm
Effective Working Field	350mm × 300mm (Customizable)
Scanning Speed	2500mm/s (maximum)
Working Field	40mm × 40mm

Automated PCB Feeding System

Magazine lifting mechanism + X-Z manipulator + fixture plate grasping mechanism for automatic feeding
Motor manipulator enables back and forth movement with electric Z-axis and mechanical claw functionality
Integrated waste collection area for automatic separation of single PCBA and waste
Dual-station loading mechanism with gripper robot for synchronous operation of upper and lower fixture plates

Automated Waste PCB Removal

Rotary cylinder enables 90-degree back and forth movement with vacuum suction for waste frame separation
Upper and lower cylinders with vacuum sucker mechanism for accurate waste frame grasping
Bin equipped with radio fiber for automatic full waste notification