UV Picosecond PCB Laser Cutting Machine with 2500mm/s Speed and 350x400mm Twin Table
Advanced UV laser cutting system designed for precision processing of 5G materials and flexible printed circuits with scanning speeds up to 2500mm/s and burr-free cutting performance.
Specialized for cutting advanced 5G materials including CCM, COB, LCP, MPI, COF, COP, PI, and CPI in consumer electronics. The system integrates high-speed optical processing with independent process optimization for precise shape cutting and depth control.
- Minimized thermal effect with improved edge quality and reduced collapse
- Non-contact processing eliminates burrs and ensures clean cuts
- Advanced process system for precise graphic calculation and parameter control
- Compatible with PCB, FPC, PI, CPI, MPI, PCBA, COF, COP, COB, FR4, LCP materials
| Parameter | Specification |
|---|---|
| Laser Type | UV, Picosecond |
| Laser Wavelength | 355nm |
| Positioning Precision | ±3μm |
| Repetition Precision | ±2μm |
| Effective Working Field | 350mm x 400mm (twin tables) |
| Scanning Speed | 2500mm/s maximum |
| Working Field | 50mm x 50mm |
Gantry structure with flying light path design enables easy production line integration. Optional IN-LINE loading/unloading systems support automated operation and double-station production. Closed optical path system processes products within 450mm range, with dual platform 200mm capability specifically engineered for FPC and PCB applications.
Ultra-short pulse UV laser technology delivers superior processing quality with clean, burr-free cuts that preserve circuit edges and components without substrate damage. Cost-effective operation eliminates the need for part reordering or blade sharpening.
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