Optowave 15W UV Laser Cutting Machine for PCB Depaneling with 355nm Wavelength and ±2μm Precision
The Optowave Laser Head Flex PCB UV Laser Cutting Machine with 15W power delivers exceptional precision for depaneling and singulation of complex circuit boards. Featuring advanced UV laser technology, this system provides minimal thermal impact and superior cutting quality for demanding microelectronics and medical device manufacturing applications.
| Parameter | Specification |
|---|---|
| Laser Type | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision | ±2μm |
| Repetition Precision | ±1μm |
| Effective Working Field | 300mm x 300mm (Customizable) |
| Scanning Speed | Up to 2500mm/s |
| Working Field | 40mm x 40mm |
- High-stability UV laser generator with 355nm wavelength
- Minimal cutting width under 25μm with ±4μm repeat accuracy
- Advanced two-axis table with closed-loop control system
- Position sensors and CCD image capture technology
- Compatible with FR4 and FPC substrate materials
- Low mechanical stress during processing
- Reduced tooling costs and flexible contour capabilities
This UV laser cutting system delivers exceptional accuracy and precision for depaneling applications, featuring minimal thermal affection and superior cut quality. The equipment ensures fast cutting speeds while maintaining micron-level precision, making it ideal for complex circuit boards requiring close tolerances and minimal debris.
Specifically designed for microelectronics and medical device manufacturers, this laser system excels in cutting, drilling, and structuring both rigid and flexible circuit substrates. The technology is particularly valuable for applications where circuit board complexity and component ratios continue to increase.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.