High-Speed Slot Die Coating Line for Perovskite & Tandem Solar Panels – Fully Customizable Atmosphere Control
- Glovebox-integrated infeed (for moisture-sensitive coatings)
- Ultrasonic cleaning & plasma treatment
- Slot die coating head with active gap stabilization (air bearing optional)
- Multi-channel liquid delivery system (up to 4 materials)
- Nitrogen-purged drying chamber with uniform airflow
- In-line annealing station (hot plate or IR)
- Thickness & uniformity optical inspection
- Automated panel sorting (pass/fail)
- Central ESD-safe control system
This high-speed slot die coating line is optimized for next-generation photovoltaic technologies (perovskite, organic PV, tandem cells). The entire coating-to-drying path can be enclosed in a nitrogen atmosphere with O₂/H₂O < 1 ppm, preventing degradation of sensitive precursors.
The slot die features piezo-actuated gap control that responds in milliseconds to substrate waviness, ensuring ultra-smooth films (Rq < 5 nm). The line handles both rigid glass and flexible polymer sheets. Full customization is available for die shape (tapered, convex), solvent compatibility, and encapsulation lamination integration.
| Parameter | Value (Standard) | Customizable Range |
|---|---|---|
| Environment | Ambient (class 1000) | N₂ glovebox (O₂/H₂O < 0.1 ppm) |
| Substrate width | 1200 mm | 100 - 2400 mm |
| Coating velocity | 0.5 - 10 m/min | 0.1 - 25 m/min (super-slow for viscous inks) |
| Wet film precision | ±0.5 µm (at 10 µm target) | ±0.2 µm (with active vibration damping) |
| Die lip material | Tungsten carbide | DLC / diamond-coated / custom alloy |
| Settling time after speed change | < 2 sec | < 0.5 sec (with feedforward control) |
| Max temperature (post-dry) | 200 °C | 400 °C (for crystallization step) |
| Liquid viscosity range | 1 - 2000 cP | 0.5 - 10000 cP (heated die & line) |
| Throughput | 40 panels/hour (1.2×2.4 m) | 10 - 120 panels/hour |
| Data interface | OPC UA, Modbus TCP | SECS/GEM, REST API |
- Perovskite absorber layer coating (Pb/Sn-based inks)
- Spiro-OMeTAD or PTAA hole transport layer
- PCBM or C60 electron transport layer for OPV
- Transparent conductive oxide (TCO) hybrid coatings
We design the slot die geometry (straight, tapered, shimless, or multi-layer co-extrusion type), environmental enclosure (full glovebox or mini-environment), substrate heating/cooling platen, syringe pump (10 mL - 20 L capacity), and software integration with your existing scheduler. Custom colors, logos, and ergonomic height adjustments are available at no extra cost.
- Active gap stabilization - compensates for substrate bowing in real time
- Ultra-low dead volume (< 0.5 mL) - ideal for expensive perovskite precursors
- Automatic meniscus control - prevents air entrainment at high speeds
- In-line solvent vapor annealing option
- Full data traceability - 21 CFR Part 11 compliant (upon request)
- 24-month comprehensive warranty
- On-site cleanroom installation & validation
- Free process support for 2 years (including formula transfer)
- Virtual reality (VR) operator training
- Loaner die head during repair or customization
- Packing: All atmosphere-sensitive parts double-bagged with N₂ backfill; main machine in heavy-duty plywood case with humidity indicator
- Shipping: OOG (out of gauge) for glovebox-enclosed models; standard 40 ft HC for open models
- Lead time: 90 - 120 days (fully custom projects)
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.