GIS Laser DPX230 LDI Machine with 610x710mm Exposure Area and ±10μm Alignment Accuracy for PCB Manufacturing
The GIS Laser DPX230 Laser Direct Imaging Machine is a high-precision LDI system designed for demanding PCB, HDI, and FPC manufacturing applications. This advanced equipment delivers exceptional accuracy with ±10μm outer alignment and supports full table splicing exposure for large-format production.
| Parameter | Specification |
|---|---|
| Effective Exposure Area | 610mm × 710mm |
| Line Width/Spacing | 25μm/25μm |
| Outer Alignment Accuracy | ±10μm |
| Line Width Tolerance | ±10% |
| High Sensing Dry Film | 35s@24"×18" |
| Laser Power | 405nm/25-50W (optional) |
| File Formats | Gerber274x, ODB++ |
| Applications | PCB, HDI, FPC, Ceramic Substrate |
- Laser Direct Imaging (LDI) technology for superior precision
- Multiple scale modes: Fixed, Auto, Interval, and Partition Alignment
- Full table splicing exposure capability
- Compatible with inner, outer, and ceramic substrate processes
- High-resolution imaging with repeatable accuracy
- Designed for quick setup and efficient production workflows
Manufactured in Suzhou, China, the DPX230 combines advanced laser technology with robust construction to deliver reliable performance in demanding manufacturing environments.
Comprehensive technical support including 24/7 assistance, installation guidance, troubleshooting, and maintenance services. We provide product training programs, online tutorials, and full warranty coverage to ensure optimal performance and longevity.
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