GIS Laser DPX230 Laser Direct Imaging Machine 610mm×710mm for 0.05-7mm PCB Board Thickness
The GIS Laser DPX230 Laser Direct Imaging Machine represents advanced laser printing technology for PCB, HDI, and FPC manufacturing. This industrial-grade equipment delivers exceptional precision with ±10% line width tolerance and supports board thickness from 0.05mm to 7mm.
- 610mm × 710mm effective exposure area for large format processing
- ±10% line width tolerance for superior precision
- Support for full table splicing exposure capability
- High sensing dry film: 35s@24"x18"
- Multiple scale modes: Fixed Scale, Auto Scale, Interval Scale, Partition Alignment
- Technology raster with line width/spacing of 25/25μm
| Parameter | Specification |
|---|---|
| Effective Exposure Area | 610mm × 710mm |
| Board Thickness Range | 0.05-7mm |
| Line Width Tolerance | ±10% |
| Technology Raster | Line width/spacing 25/25μm |
| Laser Power | 405 Nm/25-50 W (optional) |
| File Format Support | Gerber274x, ODB++ |
| Inner Alignment Accuracy | 20μm |
| Scale Modes | Fixed Scale, Auto Scale, Interval Scale, Partition Alignment |
This laser imaging equipment is specifically designed for PCB (Printed Circuit Board), HDI (High Density Interconnect), and FPC (Flexible Printed Circuit) manufacturing processes. It excels in inner, outer, and ceramic substrate applications with its advanced laser direct printing technology.
- 24/7 customer support availability
- Complimentary software updates and upgrades
- Professional on-site installation and training
- Scheduled maintenance and service programs
- Comprehensive online tutorials and technical guidance
- Repair and warranty services
The Laser Direct Imaging Machine is securely packaged with multiple protective layers including plastic wrapping for dust and moisture protection, durable box construction with cushioning materials, and proper labeling for safe transportation.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.