GIS Laser DPX230 Laser Direct Imaging Machine with ±10μm Alignment Accuracy and 610×710mm Exposure Area
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
GIS Laser
Product Description
GIS Laser DPX230 Laser Direct Imaging Machine
Advanced laser direct imaging system with ±10μm outer alignment accuracy and 610×710mm exposure area for high-precision PCB and ceramic substrate manufacturing.
Key Features
- ±10μm outer alignment accuracy for superior precision
- 25/25μm line width/line spacing technology raster
- 610mm × 710mm effective exposure area
- Supports Gerber274x and ODB++ file formats
- Text and serial number traceability capabilities
- Compatible with PCB, HDI, FPC, and ceramic substrates
Technical Specifications
| Parameter | Specification |
|---|---|
| Board Thickness Range | 0.05 - 7mm |
| Applications | PCB, HDI, FPC, Ceramic Substrates |
| Technology Raster | 25/25μm Line Width/Line Spacing |
| Line Width Tolerance | ±10% |
| Laser Power Options | 405nm / 25-50W (optional) |
| Inner Alignment Accuracy | 20μm |
| Scale Modes | Fixed Scale / Auto Scale / Interval Scale / Partition Alignment |
| Splicing Capability | Full Table Splicing Exposure |
Applications
This high-performance LDI system is engineered for precision imaging across multiple manufacturing sectors:
- PCB industry: Text and serial number printing for traceability
- Electronics manufacturing: Circuit pattern printing on ceramic substrates
- Semiconductor production: Substrate traceable information marking
- HDI and FPC manufacturing: High-density interconnect imaging
Support & Services
- Phone and online technical support
- Onsite maintenance and repair services
- Software and firmware updates
- Replacement parts and accessories
- Training and certification programs
Frequently Asked Questions
What is the GIS Laser DPX230 Laser Direct Imaging Machine?
The GIS Laser DPX230 is a high-precision laser direct imaging system designed for printed circuit boards and ceramic substrates, featuring advanced imaging technology and high-speed laser processing.
What are the main advantages of this system?
Key advantages include ±10μm outer alignment accuracy, 25/25μm line resolution, compatibility with multiple file formats, and excellent repeatability for industrial production environments.
What materials can this machine process?
The system is suitable for various printed circuit board materials including FR4, FR5, CEM-1, CEM-3, polyimide, and ceramic substrates.
What warranty is provided?
The GIS Laser DPX230 comes with a comprehensive one-year warranty from the date of purchase.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian