GIS Laser DPX230 Laser Direct Imaging Machine 0.05-7mm Board Thickness 610x710mm Exposure Area for PCB HDI FPC Manufacturing
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
GIS Laser
Product Description
GIS Laser DPX230 Laser Direct Imaging Machine
Advanced laser direct printing equipment for precision PCB, HDI, and FPC manufacturing with 20μm alignment accuracy and 610mm×710mm exposure area.
Key Features
- Laser Direct Imaging Technology: High-precision 405nm laser with 25-50W power options
- Board Thickness Range: 0.05-7mm compatibility
- Alignment Accuracy: 20μm inner alignment precision
- Exposure Area: 610mm × 710mm effective working space
- Scale Modes: Fixed, Auto, Interval, and Partition alignment options
- High-Sensing Dry Film: 35s@24 exposure efficiency
- Full Table Splicing: Support for complete panel exposure
Technical Specifications
| Parameter | Specification |
|---|---|
| Inner Alignment Accuracy | 20μm |
| Board Thickness Range | 0.05-7mm |
| Effective Exposure Area | 610mm × 710mm |
| Laser Power | 405nm / 25-50W (optional) |
| Technology Raster | Line Width/Spacing: 25/25μm |
| Line Width Tolerance | ±10% |
| Scale Modes | Fixed Scale / Auto Scale / Interval Scale / Partition Alignment |
| High Sensing Dry Film | 35s@24 |
| File Formats | Gerber274x, ODB++ |
| Applications | PCB, HDI, FPC, Ceramic Substrate |
Applications
The GIS Laser DPX230 is specifically designed for electronics manufacturing applications including printed circuit boards (PCB), high-density interconnect (HDI), flexible printed circuits (FPC), and ceramic substrate processing. Ideal for production lines requiring high-frequency printing and mass production capabilities.
Product Details
Brand: GIS Laser
Model: DPX230
Origin: Suzhou, China
Applicable Processes: Inner, Outer, Ceramic Substrate
Support & Service
Comprehensive technical support and service package including regular maintenance, troubleshooting, and repair services provided by experienced engineers.
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Get in Touch
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Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian