GIS Laser DPX230 Laser Direct Imaging Machine 405 nm 25-50 W with 610x710 mm Exposure Area
Advanced 405 nm laser technology with 25-50 W power options for high-precision PCB manufacturing
The GIS Laser DPX230 Laser Direct Imaging Machine utilizes advanced laser direct imaging (LDI) technology for precise PCB printing applications. This versatile system delivers exceptional accuracy with ±10μm outer alignment precision and supports complex, high-density PCB production.
| Parameter | Specification |
|---|---|
| Laser Power | 405 nm / 25-50 W (optional) |
| Effective Exposure Area | 610 mm × 710 mm |
| Line Width/Spacing | 25/25 μm |
| Line Width Tolerance | ±10% |
| Outer Alignment Accuracy | ±10 μm |
| Inner Alignment Accuracy | 20 μm |
| High Sensing Dry Film | 35s@24 |
| File Formats | Gerber274x, ODB++ |
- PCB manufacturing (inner and outer layers)
- High-Density Interconnect (HDI) boards
- Flexible Printed Circuits (FPC)
- Ceramic substrate processing
- Serial number and traceable text printing
- Full table splicing exposure support
- Multiple scale modes: Fixed, Auto, Interval, Partition
- Maximum processing speed: 16 mm/s
- Advanced alignment systems for precision manufacturing
Comprehensive technical support including installation assistance, troubleshooting, regular maintenance, software updates, replacement parts, and customer service via phone, email, or online chat.
GIS Laser DPX230 Laser Direct Imaging Machine
Suzhou, China
PCB substrates, HDI boards, FPC materials, ceramic substrates, and various composites
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