Laser Direct Imaging PCB 0.5-3.5mm Thickness ±10% Line Width Tolerance with 512W Laser Power
Laser Direct Imaging PCB utilizes advanced laser technology to produce high-precision circuit boards with exceptional accuracy and efficiency. This innovative manufacturing process enables precise alignment, multiple scale modes, and supports various file formats for PCB production.
- Board Thickness: 0.5-3.5mm range
- Line Width Tolerance: ±10% precision
- Alignment Accuracy: ±12μm for PAD alignment (diameter: 0.5-3.0mm)
- Solder Mask Ink: 30s exposure time @ 600x500mm (24"×20")
- Effective Exposure Area: 620x720mm (24"×28.5")
- Laser Power: 512W mixing wave total power
- Multiple Scale Modes: Fixed Scale, Auto Scale, Interval Scale, Partition Alignment
| Parameter | Specification |
|---|---|
| Solder Bridge/Opening | 50/75μm (process condition) |
| Board Thickness | 0.5-3.5mm |
| Alignment Accuracy | ±12μm |
| Line Width Tolerance | ±10% |
| Laser Power | 512W Mixing Wave Total Power |
| Applications | PCB, HDI, FPC |
Ideal for high-precision PCB manufacturing including double-sided and multi-layer circuit boards, high-density interconnection (HDI) boards, and flexible printed circuit boards (FPC). Suitable for mobile phones, computers, and various electronic equipment applications.
GIS DPX820SM Laser Direct Imaging PCB offers superior performance with multiple solder mask color options and excellent solder bridge/opening characteristics. Supports Solder Mask and Outer processes with reliable efficiency.
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