GIS DPX820SM Laser Direct Imaging PCB with 512W Power and 620x720mm Exposure Area for HDI FPC Applications
Laser Direct Imaging (LDI) PCB combines advanced laser technology with direct imaging printing to deliver an efficient and precise PCB fabrication system. Designed for PCB, HDI, and FPC applications, this system features a total power of 512W and an effective exposure area of 620x720mm, making it suitable for diverse manufacturing requirements.
- Product Name: Laser Direct Imaging PCB
- Laser Power: Mixing Wave Total Power 512W
- Board Thickness: 0.5~3.5mm
- Line Width Tolerance: ±10%
- Applicable Process: Solder Mask, Outer
- Solder Mask Ink: 30s@600x500mm(24)
| Parameter | Specification |
|---|---|
| Application | PCB, HDI, FPC |
| Effective Exposure Area | 620x720mm |
| Alignment Accuracy | ±12μm |
| Board Thickness | 0.5~3.5mm |
| Solder Bridge/Solder Opening | 50/75μm (process condition) |
| Solder Mask Color Options | Fixed Scale / Auto Scale / Interval Scale / Partition Alignment |
| Scale Mode Colors | White, Black, Yellow, etc. |
GIS DPX820SM Laser Direct Imaging PCB is engineered for high-precision applications requiring superior accuracy and reliability. With ±12μm alignment accuracy and customizable solder mask options, this system is ideal for demanding PCB, HDI, and FPC manufacturing projects.
This Laser Direct Imaging Printed Board (Model: DPX820SM) offers flexible customization including solder mask color settings, line width tolerance of ±10%, and effective exposure area of 620x720mm. Manufactured by GIS in Suzhou, China, it provides reliable performance for all your PCB fabrication needs.
Comprehensive technical support, product documentation, troubleshooting guides, and online tutorials are available. Our customer service team provides 24/7 assistance with money-back guarantee and free shipping on all products.
PCBs are securely packaged in shock-absorbent boxes, sealed with proper documentation, and shipped via reputable carriers using protective bubble wrap.
Q: What is Laser Direct Imaging PCB?
A: LDI is a technology that uses lasers to directly expose copper foil with fine circuit patterns at high speed.
Q: What is the brand and model?
A: GIS DPX820SM
Q: Where is it manufactured?
A: Suzhou, China
Q: What are the advantages?
A: High-density circuit production, improved accuracy, repeatability, reliability, and durability.
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