GIS DPX820SM Laser Direct Imaging PCB with 512W Power and 620x720mm Exposure Area for HDI/FPC Applications
Laser Direct Imaging Printed Circuit Board (LDIPCB) represents cutting-edge technology for high-precision PCB manufacturing. This advanced system eliminates traditional photolithography processes, delivering superior accuracy and reliability for demanding electronic applications.
- Product Name: Laser Direct Imaging PCB
- Alignment Method: PAD (diameter: 0.5~3.0mm)
- Applications: PCB, HDI, FPC
- Board Thickness: 0.5~3.5mm
- Scale Mode: White, Black, Yellow, etc.
- Effective Exposure Area: 620x720mm (24")
| Parameter | Specification |
|---|---|
| Solder Mask Ink | 30s@600x500mm |
| Laser Power | 512W Mixing Wave Total Power |
| Line Width Tolerance | ±10% |
| Solder Bridge/Solder Opening | 50/75μm (Process Condition) |
| Alignment Method | PAD (Diameter: 0.5~3.0mm) |
| Board Thickness Range | 0.5~3.5mm |
| Effective Exposure Area | 620x720mm (24") |
Ideal for Printed Circuit Board (PCB), High-density Interconnect (HDI), and Flexible Printed Circuit (FPC) manufacturing. The GIS DPX820SM model delivers exceptional performance with ±12μm alignment accuracy, making it particularly suitable for LED applications and other precision electronics.
Custom Laser Direct Imaging PCB services available with brand name GIS and model number DPX820SM. Manufactured in Suzhou, China, with comprehensive customization capabilities including specific board thickness requirements and application-specific configurations.
Comprehensive technical support services including design consultation, equipment installation, maintenance, troubleshooting, process optimization, and professional training for laser direct imaging systems.
Securely packaged in anti-static materials and shipped via express carriers (FedEx, UPS, DHL) to ensure safe and timely delivery.
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