GIS DPX725T LDI Equipment for PCB HDI FPC with 635mm×810mm Exposure Area and 20/20μm Resolution
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
GIS
Product Description
Advanced Laser Direct Imaging Equipment for PCB Manufacturing
Key Specifications
Effective Exposure Area: 635mm × 810mm (25" × 32") | Board Thickness Range: 0.1-3mm | Throughput: 360 panels/hour @ 500×600mm
Technical Specifications
| Parameter | Specification |
|---|---|
| File Format Support | Gerber274x, ODB++ |
| Board Thickness Range | 0.1-3mm |
| Inner Alignment Method | UV-Mark Technology |
| Laser Power Options | 25-50W (configurable) |
| Technology Raster Capability | Line Width/Spacing: 20/20μm |
| Outer Alignment Accuracy | ±12μm |
| Inner Alignment Accuracy | ±24μm |
| Line Width Tolerance | ±10% |
| Technology Platform | Laser Direct Imaging with Line Automation |
Core Features & Benefits
- High-Precision Imaging: Achieves exceptional 20/20μm line width/spacing with ±10% tolerance
- UV-Mark Alignment: Advanced inner layer alignment system ensures precise registration
- Dual Process Capability: Supports both inner and outer layer exposure processes
- High Throughput: Processes up to 360 panels per hour at 500×600mm size
- Flexible Configuration: Available in 25W or 50W laser power options
- Broad Compatibility: Works with standard industry file formats (Gerber274x, ODB++)
Applications
Ideal for high-density interconnect (HDI) PCBs, flexible printed circuits (FPC), and advanced multilayer board manufacturing requiring superior precision and throughput.
Customization & Support
The GIS DPX725T LDI equipment offers comprehensive customization options to meet specific production requirements. Our technical support team provides assistance through multiple channels including website, telephone, email, and live chat.
Product Identification
Brand: GIS | Model: DPX725T | Manufacturing Location: Suzhou, China
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian