LDI Equipment with ±12μm Alignment Accuracy and 635mm×810mm Exposure Area for PCB Wire Bonding
LDI Equipment delivers reliable and precise automated wire bonding solutions with superior performance for various industrial processes. Engineered for both inner and outer wire bonding applications, this system ensures exceptional accuracy and efficiency in PCB manufacturing.
| Parameter | Specification |
|---|---|
| Outer Alignment Accuracy | ±12μm |
| Inner Alignment Accuracy | 24μm |
| Board Thickness Range | 0.1 to 3mm |
| Effective Exposure Area | 635mm × 810mm (25" × 32") |
| Laser Power | 25-50W (optional) |
| Line Width Tolerance | ±10% |
- Advanced Laser Digital Imaging Technology
- Precision Lead Frame Technology
- Supports Gerber274x and ODB++ File Formats
- Flexible Scale Modes: Fixed Scale and Auto Scale
- Ideal for Inner and Outer Wire Bonding Processes
PCB, HDI, FPC manufacturing with applications in factory automation, industrial control, and power distribution systems.
Comprehensive technical assistance including installation guidance, troubleshooting, and maintenance support. Access to technical documentation and online resources.
On-site and remote maintenance, repairs, and upgrades. Warranty coverage and replacement parts available. Custom services tailored to specific requirements.
Sturdy corrugated boxes with foam inserts ensure equipment protection during transit. All shipments include tracking information. International delivery typically completes within 2-4 weeks.
GIS
DPX725T
Suzhou, China
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