380V Three Phase LDI Laser Direct Imaging System for PCB HDI FPC - 30μm Resolution, 610×710mm Exposure
Professional LDI system solutions for various PCB applications including HDI and FPC manufacturing with precision exposure technology.
Laser Direct Imaging (LDI) revolutionizes PCB fabrication by exposing circuit traces directly with a computer-controlled laser beam instead of traditional photo tool methods. This digital imaging process ensures superior precision and eliminates the need for physical masks.
The system positions a PCB with a photo-sensitive surface under a computer-controlled laser. The computer scans the board surface into a raster image, matches it with pre-loaded CAD/CAM design files, and uses the laser to directly create the circuit image with exceptional accuracy.
| Specification | DPX230 Model Details |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30μm |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% to -10% |
- Yellow light room environment
- Temperature: 22°C ± 1°C
- Humidity: 50% ± 5%
- Cleanliness level: 10000 and above
- Vibration: Avoid violent vibration near equipment
We provide innovative LDI system solutions ranging from configurations for high-mix and emerging PCB niche applications to fully automated systems for mass production environments.
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