DPX230 LDI Laser Direct Imaging Equipment for PCB HDI FPC with 30μm Resolution and 0.05-3.5mm Panel Thickness
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging System Overview
Our advanced laser direct imaging (LDI) system solutions are engineered for various PCB applications including multilayer boards, HDI, and flexible printed circuits. This technology revolutionizes circuit board fabrication by eliminating traditional phototool requirements.
How Laser Direct Imaging Technology Works
The LDI process exposes circuit traces directly using a highly focused, computer-controlled laser beam instead of traditional flooded light through phototools. A PCB with a photosensitive surface is positioned under the laser, and the computer creates the circuit pattern by scanning the board surface as a raster image that matches pre-loaded CAD or CAM design specifications.
DPX230 Technical Specifications
| Specification/Model | DPX230 |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, solder mask) |
| Resolution (mass production) | 30μm |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Deviation Compensation | Fixed expansion/contraction, automatic expansion/contraction, interval expansion/contraction, partition alignment |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% to -10% |
| Environmental Conditions | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10,000 and above |
| Vibration Requirements | Avoid violent vibration near equipment |
Key System Advantages
- Eliminates phototool costs and maintenance
- High precision alignment with ±12μm outer layer accuracy
- Wide panel thickness compatibility from 0.05mm to 3.5mm
- Advanced deviation compensation for superior registration
- Optimized for both high-mix and mass production environments
About Our Company
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions. Our product portfolio ranges from configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian