133LPI 2540dpi Laser Direct Imaging Equipment for 3D Glass Cover Panel with 1500x600mm Exposure Area
Our laser direct imaging solutions leverage proprietary technology and modular X-Series hardware to deliver superior image quality, increased production yields, and reduced total cost of ownership for PCB manufacturing applications.
This complete automation system specializes in BM patterning processes for 3D smartphone glass, featuring:
- Fully automated material handling from loading to unloading
- Integrated plasma cleaning and spray coating systems
- High-resolution DLP exposure technology
- Advanced developing and washing processes
- Resolution up to 30μm with over 95% production yield
- Thinner BM layers for simplified assembly processes
- Enhanced pattern quality with reduced operational costs
| Specification | Details |
|---|---|
| Dimensions (customizable) | 3850mm × 1350mm × 1800mm |
| Weight | 3000 KG |
| Maximum Power | 4 KW |
| Maximum Exposure Area (customizable) | 1500mm × 600mm × 200mm |
| Laser Source | 375nm±10nm, 405nm±10nm |
| Laser Output Power | 375-12W (±3%), 405-5W (±3%) |
| Laser Transmission | Optical Fiber |
| Lens Magnification | 1.95 times / 3.95 times |
| Resolution | 12700 dpi |
| Spot Size | 40mm × 7mm |
| Hardware Repeatability | ±5μm |
| Photosensitive Material | Photoresist |
| Input Document Format | Gerber274x |
GIS Intelligent Inc., a subsidiary of GIS Tech Inc., specializes in advanced lithium battery fabrication and 3D cover glass patterning solutions. Founded in 2015 by U.S. professionals, we develop Digital Lighting Processing (DLP) technology for various industrial patterning applications.
Our leadership in 3D cover glass automation combines semiconductor laser diode technology with enhanced depth-of-focus capabilities for complex 3D topographies, serving 3C smart electronics and automotive glass markets.
Specifications subject to change without notice
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