610mm x 710mm LDI Equipment with 30μm Resolution and 24μm Alignment for PCB Manufacturing
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging System Overview
Laser Direct Imaging (LDI) systems provide advanced PCB manufacturing solutions by using computer-controlled laser beams to directly define circuit patterns onto boards, eliminating the need for traditional photo-tools and UV-light exposure methods.
Technical Specifications
| Specification | DPX230 Model Details |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution | 30μm (mass production) |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610mm × 710mm |
| Panel Thickness | 0.05mm - 3.5mm |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Laser Type | LD Laser, 405±5nm |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz |
| Environmental Conditions | Yellow light room; Temperature 22°C ±1°C; Humidity 50% ±5%; Cleanliness level 10000+ |
Key Features
- Computer-controlled laser beam for direct pattern imaging
- Eliminates traditional photo-tool requirements
- Supports Gerber 274X and ODB++ file formats
- Multiple deviation control modes including fixed, automatic, and partition alignment
- ±10% line width tolerance for precision manufacturing
Company Profile
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions, offering configurations ranging from high-mix and emerging PCB applications to fully automated mass production environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian