Laser Direct Imaging LDI Equipment 30μm Resolution 0.05-3.5mm Panel Thickness for PCB Manufacturing
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging (LDI) Equipment
Advanced PCB exposure system with 30μm resolution and 0.05-3.5mm panel thickness capability
Technology Overview
Laser Direct Imaging (LDI) represents the modern approach to PCB exposure processes, eliminating traditional phototool negatives. This system utilizes high-energy laser beams to directly transfer circuit patterns onto copper-clad laminates coated with photoimaging agents, delivering superior precision and efficiency.
How LDI Technology Works
The LDI process positions a photosensitive PCB surface under a computer-controlled laser. The system scans the board surface into a raster image, matches it with pre-loaded CAD/CAM design files, and uses the laser to directly create the required circuit image with exceptional accuracy.
Technical Specifications
| Specification | DPX230 Model Details |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30μm |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm - 3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer: ±12μm; Inner layer: ±24μm |
| Line Width Tolerance | ±10% |
| Deviation Control Modes | Fixed increase/contraction, automatic increase/contraction, interval increase/contraction, partition alignment |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% to -10% |
| Operating Environment | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Avoid violent vibration near equipment |
Key Advantages
- Eliminates phototool costs and maintenance
- Superior alignment precision with UV-Mark technology
- Handles diverse PCB types including HDI and FPC
- Multiple deviation control modes for flexible production
- High-resolution 30μm capability for fine-line circuits
About Our Solutions
We provide comprehensive LDI system solutions ranging from configurations for high-mix and emerging PCB applications to fully automated systems for mass production environments. Our innovative approach ensures reliable performance across diverse manufacturing requirements.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian