LD Laser LDI Equipment 405±5nm Three-Phase with 30μm Resolution and 610×710mm Exposure Size for PCB Manufacturing
Our LD Laser LDI equipment provides cutting-edge solutions for complex PCB manufacturing challenges, delivering superior precision for fine line imaging requirements in modern electronics production.
Laser Direct Imaging (LDI) revolutionizes PCB manufacturing by using computer-controlled laser beams to directly define circuit patterns on copper-clad laminate surfaces. This advanced technology eliminates the need for traditional photo-tools and UV light exposure, enabling higher precision and finer line resolution.
| Specification | DPX230 Model Details |
|---|---|
| Applications | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30μm |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness Range | 0.05mm - 3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type & Wavelength | LD Laser, 405±5nm |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz |
| File Format Support | Gerber 274X; ODB++ |
- Yellow light room environment
- Temperature: 22°C ± 1°C
- Humidity: 50% ± 5%
- Cleanliness level: 10000 and above
- Vibration-free installation location
The system supports multiple deviation compensation modes including fixed increase and contraction, automatic increase and contraction, interval increase and contraction, and partition alignment for optimal precision.
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions. Our product portfolio ranges from specialized LDI configurations for emerging PCB applications to fully automated systems for high-volume production environments.
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