50um Laser Direct Imaging System 610mm x 710mm Exposure Size 0.05-3.5mm Panel Thickness for PCB Manufacturing
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging System Overview
Advanced 50um laser direct imaging (LDI) system designed for PCB solder mask applications, supporting panel sizes up to 610mm x 710mm and thickness range of 0.05mm-3.5mm.
LDI Advantages Over Traditional Photo Processing
Laser direct imaging eliminates multiple steps required in traditional photo processing methods, providing superior quality and efficiency for PCB manufacturing.
Key Benefits
- Enhanced Quality: Eliminates film-related defects caused by temperature and humidity fluctuations, delivering more accurate and consistent images
- Precision Imaging: Improved resolution with accurate positioning, precise image lines, spaces, and superior alignment capabilities
- Environmental Stability: Reduces environmental impact on image quality and eliminates light refraction issues inherent in photo processing
- Operational Efficiency: Ideal for short runs and quick turn-around projects where traditional photo tool creation is impractical
- Tight Tolerance Performance: Essential for applications requiring close registration and tight tolerances
Technical Specifications - Model DPX230
| Specification | Details |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30um |
| Capacity | 30-40S@18"*24" |
| Exposure Size | 610mm x 710mm |
| Panel Thickness | 0.05mm - 3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12um; Inner layer ±24um |
| Line Width Tolerance | ±10% |
| Deviation Control Modes | Fixed increase/contraction, automatic increase/contraction, interval increase/contraction, partition alignment |
| Laser Type | LD Laser, 405±5nm |
| File Format Support | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50HZ, voltage fluctuation range +7% ~ -10% |
| Operating Conditions | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above |
| Vibration Requirements | Avoid violent vibration near equipment |
How Laser Direct Imaging Works
The LDI process positions a PCB with a photo-sensitive surface under a computer-controlled laser. The computer scans the board surface into a raster image, matches it to pre-loaded CAD/CAM design files, and uses the laser to directly create the specified image on the board surface.
About Our Company
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions. Our product portfolio ranges from LDI configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian