DPX230 LDI Laser Direct Imaging System with 405nm Laser, 30μm Resolution, and 610×710mm Exposure Area
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging (LDI) System Overview
Our advanced LDI systems utilize 405±5nm laser technology to deliver precise circuit board imaging for PCB, HDI, and FPC applications including inner layer, outer layer, and solder mask processing.
Technical Specifications
| Specification | Details |
|---|---|
| Model | DPX230 |
| Applications | PCB, HDI, FPC (inner layer, outer layer, solder mask) |
| Resolution | 30μm (mass production) |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm-3.5mm |
| Laser Type | LD Laser, 405±5nm |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz |
| Operating Environment | Yellow light room; Temperature 22°C±1°C; Humidity 50%±5%; Cleanliness level 10000+ |
Key Features
- High-precision 30μm resolution for mass production
- Advanced UV-Mark alignment system
- Multiple deviation compensation modes
- Supports Gerber 274X and ODB++ file formats
- Robust construction for industrial environments
About Our Solutions
We provide comprehensive PCB laser direct imaging system solutions ranging from configurations for high-mix and emerging PCB applications to fully automated systems for mass production environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian