30μm Laser Direct Imaging HDI PCB System 610x710mm Exposure 380V Three Phase DPX230
Advanced LDI technology delivering 30μm resolution with 610×710mm exposure capacity for high-precision PCB production.
Laser Direct Imaging (LDI) represents the latest advancement in PCB manufacturing technology, replacing traditional phototool methods with computer-controlled laser exposure for superior accuracy and efficiency.
The system positions a PCB with a photosensitive surface under a computer-controlled laser. The computer scans the board surface into a raster image, matching it to pre-loaded CAD/CAM design files, then uses the laser to directly create the circuit image on the board with exceptional precision.
| Specification | Details |
|---|---|
| Model | DPX230 |
| Applications | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution | 30μm (mass production) |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm - 3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer: ±12μm; Inner layer: ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% to -10% |
- Yellow light room environment
- Temperature: 22°C ± 1°C
- Humidity: 50% ± 5%
- Cleanliness level: 10000 and above
- Vibration: Avoid violent vibration near equipment
- Eliminates phototool costs and lead times
- Superior alignment accuracy for HDI applications
- Multiple deviation compensation modes
- Suitable for both prototype and mass production
We provide comprehensive PCB laser direct imaging system solutions ranging from configurations for high-mix and emerging PCB niche applications to fully automated LDI systems for mass production environments.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.