1200x1300mm UV Laser Direct Imaging Equipment with 12700 DPI Resolution and 4KW Power for 3D Glass Manufacturing
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging Equipment Overview
This 1200x1300mm UV Laser Direct Imaging (LDI) equipment represents advanced technology for 3D glass cover panel manufacturing, offering superior precision and efficiency compared to traditional exposure methods.
Technology Advantages
LDI vs Traditional CCD Exposure
- Eliminates film requirements, reducing production costs
- Accelerates sample delivery timelines
- Minimizes film production and alignment errors
- Delivers more precise circuit exposure accuracy
- Essential for high-precision circuit manufacturing
DLP Exposure Technology
GIS DLP Exposure machine utilizes Digital Lighting Processing technology for 3D glass patterning, providing high-resolution imaging with exceptional throughput and yield rates.
- Integrated stable cooling system maintains constant 22°C internal temperature
- Semiconductor photolithography process with negative photoresist
- Enables high-quality pattern transfer to 3D cover glass
- Achieves one-pass yields exceeding 95%
Automation Line Capabilities
Complete automation solution for BM patterning on 3D smartphone glass, featuring integrated processing stations from loading to final output.
- Automatic loading and unloading systems
- Plasma cleaning and automatic spraying
- Tunnel oven and developing/washing stations
- Resolution up to 30μm
- Thinner BM layers for easier assembly
- Superior pattern quality with reduced ownership costs
Technical Specifications
| Specification/Model | GD-300 |
|---|---|
| Dimensions (mm) | 3850×1350×1800 (customizable) |
| Weight | 3000 KG |
| Maximum Power | 4 KW |
| Maximum Exposure Area | 1500×600×200mm (customizable) |
| Laser Source | 375nm±10nm, 405nm±10nm |
| Laser Output Power | 375-12W (±3%), 405-5W (±3%) |
| Laser Transmission | Optical Fiber |
| Lens Magnification | 1.95× / 3.95× |
| Resolution | 12700 DPI |
| Spot Size | 40×7mm |
| Hardware Repeatability | ±5μm |
| Photosensitive Material | Photoresist |
| Input Document Format | Gerber274x |
Specifications subject to change without notice
Company Background
GIS Intelligent Inc., a subsidiary of GIS Tech Inc., specializes in advanced solutions for lithium battery fabrication and 3D cover glass patterning. Established in 2015 by founders from the United States, the company develops Digital Lighting Processing (DLP) technology for various industry patterning requirements.
As global leaders in 3D cover glass automation, GIS combines semiconductor laser diode technologies with DLP photolithography to achieve enhanced depth-of-focus for 3D topography and superior patterning uniformity.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian