DPX230 Laser Direct Imaging LDI System for PCB Manufacturing - 30μm Resolution, 0.05-3.5mm Panel Thickness, 380V Three-Phase Power
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
Laser Direct Imaging System Overview
Our advanced Laser Direct Imaging (LDI) system solutions are designed for various PCB multilayer applications, providing precision imaging for circuit board fabrication.
How Laser Direct Imaging Technology Works
Unlike traditional methods using photo tools and flooded light, LDI exposes circuit traces directly with a highly focused, computer-controlled laser beam. This digital imaging process eliminates the need for physical masks, delivering superior accuracy and efficiency.
DPX230 Technical Specifications
| Specification/Model | DPX230 |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30μm |
| Capacity | 30-40S@18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Deviation Control Modes | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% to -10% |
| Environmental Conditions | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above |
| Vibration Requirements | Avoid violent vibration near the equipment |
Key System Features
- Digital imaging eliminates photo tool requirements
- High-precision laser exposure with 30μm resolution
- Wide panel thickness range from 0.05mm to 3.5mm
- Advanced alignment capabilities with UV-Mark technology
- Multiple deviation control modes for flexible operation
- Compatible with industry-standard file formats
About Our Company
We are an innovative supplier of comprehensive PCB laser direct imaging system solutions. Our product portfolio ranges from LDI configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian