PCB HDI FPC Laser Direct Imaging System DPX230 - 610mm×710mm Exposure, 30μm Resolution, 0.05-3.5mm Panel Thickness

Price Negotiable

Price: negotiable price

MOQ: 1 set

Delivery Time: 20 work days

Brand: GIS

Product Description

PCB Laser Direct Imaging System Overview

Our advanced Laser Direct Imaging (LDI) system provides comprehensive solutions for various PCB multilayer applications, eliminating traditional photolithography limitations with superior precision and efficiency.

Key Advantages of LDI Technology

Enhanced Quality: Eliminates film-related defects and environmental sensitivity, ensuring consistent imaging precision
Superior Precision: Laser imaging provides accurate positioning with improved resolution for trace widths and alignment
Environmental Stability: Reduces impact of temperature and humidity fluctuations compared to traditional photo processing
Process Efficiency: Removes light reflection issues inherent in conventional photo processing techniques

Technical Specifications - DPX230 Model

Specification	Details
Application	PCB, HDI, FPC (inner layer, outer layer, anti-welding)
Resolution (Mass Production)	30μm
Capacity	30-40 panels @ 18"×24"
Exposure Size	610mm × 710mm
Panel Thickness Range	0.05mm - 3.5mm
Alignment Capability	Outer layer: ±12μm; Inner layer: ±24μm
Line Width Tolerance	±10%
Laser Type	LD Laser, 405±5nm
Power Requirements	380V three-phase AC, 6.4kW, 50HZ

HDI Production Capabilities

High-quality exposure of fine lines and spaces down to 0.075mm (4mil) and below
Excellent depth of focus for uniform exposure of outer layers and Sequential Build Up (SBU)
Flexible system design accommodating various product types, materials, and manufacturing technologies
Highly accurate registration system compatible with different production steps
Dynamic compensation for material dimension changes to achieve tight registration tolerance

Operational Requirements

Environmental Conditions

Yellow light room; Temperature: 22°C ± 1°C; Humidity: 50% ± 5%; Cleanliness level: 10,000 and above

Installation Requirements

Avoid installation near sources of violent vibration to ensure optimal performance and precision.

About Our LDI Solutions

As an innovative supplier of PCB laser direct imaging systems, our product portfolio ranges from configurations for high-mix and emerging PCB niche applications to fully automated solutions for mass production environments.