Jiangsu GIS Laser Technologies Inc.,
                                                                                                           
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HDI FPC LDI Laser Direct Imaging System 610x710mm 30μm Resolution for PCB Manufacturing

Price Negotiable
Price: negotiable price
MOQ: 1 set
Delivery Time: 20 work days
Brand: GIS
Product Description
HDI FPC LDI Laser Direct Imaging System
Advanced laser direct imaging (LDI) system solutions designed for various PCB multilayer applications including HDI and FPC manufacturing.
Laser Direct Imaging Technology
PCB laser direct imaging (LDI) exposes circuit traces directly using a highly focused, computer-controlled laser beam instead of traditional photo tool methods. This digital imaging process eliminates the need for physical masks, providing superior precision and efficiency.
How LDI Technology Works
The system positions a PCB with a photo-sensitive surface under a computer-controlled laser. The computer scans the board surface into a raster image, matches it to pre-loaded CAD/CAM design files, and uses the laser to directly create the required image on the board with exceptional accuracy.
Technical Specifications
Specification/Model DPX230
Application PCB, HDI, FPC (inner layer, outer layer, anti-welding)
Resolution (Mass Production) 30μm
Capacity 30-40 seconds @ 18"×24"
Exposure Size 610×710mm
Panel Thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment Capability Outer layer ±12μm; Inner layer ±24μm
Line Width Tolerance ±10%
Deviation Adjustment Modes Fixed increase/contraction, automatic increase/contraction, interval increase/contraction, partition alignment
Laser Type LD Laser, 405±5nm
File Format Gerber 274X; ODB++
Power Requirements 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% ~ -10%
Operating Environment Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above
Vibration Requirements Avoid violent vibration near equipment
Key Advantages
  • High precision 30μm resolution for mass production
  • Large 610×710mm exposure area capability
  • Compatible with PCB, HDI, and FPC applications
  • Advanced alignment system with ±12μm outer layer accuracy
  • Multiple deviation adjustment modes for flexible operation
  • 405nm LD laser technology for superior imaging quality
About Our Company
We are an innovative supplier of comprehensive PCB laser direct imaging (LDI) system solutions. Our product portfolio ranges from LDI configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Jiangsu GIS Laser Technologies Inc.,
Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person Tian

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