260mm × 810mm Laser Direct Imaging PCB System - 15μm Resolution, 380V Three-Phase Power for HDI/FPC Manufacturing
Our 260mm × 810mm Laser Direct Imaging (LDI) system delivers precision imaging solutions for PCB manufacturing, utilizing advanced 405nm laser technology for superior pattern accuracy and production efficiency.
| Parameter | Specification |
|---|---|
| Model | RTR315 |
| Applications | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Production Resolution | 15μm |
| Exposure Size | 260mm × 800mm |
| Panel Thickness Range | 0.05mm - 3.5mm |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Laser Type | LD Laser, 405±5nm |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz |
| Operating Environment | Yellow light room; Temperature 22°C ±1°C; Humidity 50% ±5% |
- High-precision 15μm resolution for detailed circuit patterns
- Advanced alignment system with ±12μm outer layer accuracy
- Compatible with multiple file formats including Gerber 274X and ODB++
- Flexible panel thickness handling from 0.05mm to 3.5mm
- Multiple deviation compensation modes for optimal results
- Industrial-grade 380V three-phase power system
Laser Direct Imaging eliminates traditional phototool requirements by directly exposing circuit traces using computer-controlled laser beams, resulting in higher accuracy and reduced production steps.
The system positions PCBs with photosensitive surfaces under computer-controlled lasers, scanning board surfaces into raster images that match pre-loaded CAD/CAM design files for precise pattern creation.
We provide comprehensive LDI system configurations ranging from high-mix and niche PCB applications to fully automated solutions for mass production environments, ensuring optimal performance across diverse manufacturing requirements.
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