Jiangsu GIS Laser Technologies Inc.,
                                                                                                           
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Laser Direct Imaging LDI Machine RTR315 for Flexible PCB Boards 260x800mm Exposure with 15μm Resolution

Price Negotiable
Price: negotiable price
MOQ: 1 set
Delivery Time: 20 work days
Brand: GIS
Product Description
Laser Direct Imaging System for PCB Manufacturing
Advanced LDI technology addresses the growing complexity of HDI PCB interconnections, providing superior solutions for fine line production where conventional methods fall short.
Technology Overview
Laser Direct Imaging (LDI) revolutionizes PCB manufacturing by using computer-controlled laser beams to directly define circuit patterns on copper-clad laminate surfaces coated with laser photoresist. This digital imaging process eliminates the need for traditional photo-tools and UV light exposure methods.
How LDI Works
The system positions a PCB with a photosensitive surface under a computer-controlled laser. The computer scans the board surface into a raster image, matches it with pre-loaded CAD/CAM design files, and uses the laser to directly create the precise circuit patterns specified in the design.
Technical Specifications - Model RTR315
Parameter Specification
Application PCB, HDI, FPC (inner layer, outer layer, anti-welding)
Resolution (Mass Production) 15μm
Capacity 12 panels @ 18"×24"
Exposure Size 260×800mm
Panel Thickness Range 0.05mm - 3.5mm
Alignment Mode UV-Mark
Alignment Capability Outer layer: ±12μm; Inner layer: ±24μm
Line Width Tolerance ±10%
Laser Type LD Laser, 405±5nm
File Format Gerber 274X; ODB++
Power Requirements 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% to -10%
Operating Environment Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above
Key Advantages
  • Superior fine line resolution for complex HDI PCB designs
  • Digital imaging eliminates photo-tool costs and maintenance
  • High precision alignment with ±12μm outer layer accuracy
  • Flexible board handling from 0.05mm to 3.5mm thickness
  • Multiple deviation compensation modes for optimal results
About Our Solutions
We provide comprehensive PCB laser direct imaging system solutions ranging from configurations for high-mix and emerging niche applications to fully automated systems for mass production environments.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Jiangsu GIS Laser Technologies Inc.,
Location Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person Tian

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