Fast Acting 24V-72V DC 250mA-30A Surface Mount Chip Fuse 1206 SMD Fuse

Price Negotiable

Price: Negotiable

MOQ: 2000PCS

Delivery Time: 5-7 Days

Brand: Tian Rui

Product Description

1206 Tape Pacakge Copper Elecment Small Quick Blow Fast Acting Surface Mount Chip Fuse

Description

12.000 Series are the fuses set the industry standard for perfor m a nce,reliability and
quality. The solder-free design provides excellent on-off andte m p erature cycling characteristics during use and also m akes our S M Dfuses m ore heat and shock tolerant than typical sub miniature fuses.

E1 ectrical Characteristcs
Rated Current	1. OIn	2.5In	3. 5In
250mA~ 5A	4hours, min .	5 sec max.	-
6A~ 30A	4hours, min .	-	5secmax.

Specification

Part No.	Rated Voltage (Vdc)					Rated Current (A)	Breaking Capacity		Typical Cold Resistance (mOhms)²	Typical Voltage Drop (mV)	Typical Pre- Arcing I²t(A² Sec)³	Marking
12.000. 0. 25						0.25	300A@ 72/63 /32Vdc	300a@ 24Vdc	3500	1400	0.00038	-
12.000. 0. 375						0.375			1750	730	0.00077	-
12. 000. 0.5						0.5			980	700	0.0019	-
12. 000. 0.75						0.75			800	700	0.15	-
12.000. 1						1			470	490	0.18	H
12. 000. 1.5						1.5			218	355	0.4	K
12.000. 2						2			133	305	1.1	N
12. 000.2.5						2.5			79	240	1.7	O
12. 000.3						3			49	185	2.2	P
12. 000.3. 5						3.5			37	180	2.7	R
12. 000.4						4			33	169	3.2	S
12.000. 4.5	72	72	63	32	24	4.5			28	160	4.2	X
12. 000. 5						5			23	140	6	T
12. 000. 6						6			15.5	150	12	F
12. 000. 7						7			11.5	130	18	J
12. 000. 8						8			7.3	110	18	V
12. 000. 10						10			6.5	90	30	U
12. 000. 12						12			4.7	90	45	W
12. 000. 15						15			3	90	33	Y
12. 000. 20						20			2	90	80	Q
12. 000. 25						25			3	90	60	L
12. 000. 30						30			2.1	90	100	Z

Packaging

3,000 pieces of fuses in paper tap er and reeled on a 178 m m(7 inch) reel

Type	A	B	W	F	E
Spec	3.50士0. 20	1.90士0. 20	8.00士0.20	3. 50士0.05	3. 50士0.05
Type	P	P0	P1	DO	T
Spec	4. 00士0. 10	4.00士0. 10	2.00士0.05	2.00士0.05	0. 75土0. 10

(Unit: mm)

Soldering Parameters

Reflow Con diton		Pb-free asse m bly
Pre Heat	-Te mperature Min (Ts(min))	1 50℃
	= Temperature Max (Ts(max))	200℃
	-Time_ (Minto Max) (ts)	60一120 seconds
Average Ramp-up Rate ILiquidus Te mp		3 ℃/second max
TS(max) to TL- Ramp-up Rate		5℃/second max
Reflow	- Te mperature (TL) (Liquidus) 一Te mp erature (tL)	217℃ 60 - 150 seconds
Peak Tem perature (T^P)		I 260+0/-5℃
Time within 5° C of actual peak Te mperature (t^P)		30 seconds
Ramp-down Rate Time 25° C to peak Te mperature (T^P) Do not exceed		6° C/second max 8 minutes max 260℃
Wave Soldering		260 ℃ 10 seconds max.

Product Characteristics

Materials	Body: Advanced Hi gh Te m perature Substrate Ter: mi natons: 100% Tin over Nickel over Copper Element Cover Coat: Confor mal C oating
Operatng Temperature	-55 ℃ to 125 ℃ Consult te mperature rerating curve chart.
Thermal Shock	W ithstands 5 cyclesof-55 ℃ to 125℃
Hu mi dity	MIL-STD-202F,Method 103B, Condition D
Vi braton	Per MIL-STD-202F,Method 201A
Insulaton Resistance (Afer Opening)	Greater than 10, 000 ohms
Resistance to Soldering Heat	MIL-STD-202G, Method 210F,Cond ition D