Topmatch Electronics (Suzhou) Co., Limited.
                                                                                                           
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Tv Screen Tcon Module High Tg FR4 12Layer IPC 6012 Class 2

Price Negotiable
Price: Negotiation
MOQ: Negotiation
Delivery Time: 10-14working days
Brand: TOPCBS
Product Description

12Layer Rigid-flex HDI PCB for Tcon LCM / Soft gold finger

 

Flex-rigid PCBs derive their name from the fact that they use a combination of flexible and rigid circuitry areas. Like most printed circuit boards, flex-rigid boards have multiple layers but generally have more than conventional designs.

 

These additional conductive layers are outlined with rigid or flexible insulation depending on the product needs. Outer layers on a board — no matter how many there are — often contain exposed pads or covers for safety. Conductors are deployed for the primary rigid layer, while flexible plated through-holes are used for any additional layers both flexible and rigid.

 

Some projects call for using traditional rigid technologies and designs. Others have limitations that prevent manufacturers from using these larger, less flexible boards. For instance, mobile and portable devices would suffer if designed with standard boards. There are just too many moving parts and components that would perform poorly when subjected to certain conditions. Mobile devices need to be portable, lightweight and able to tolerate conditions like heat, cold and, at times, moisture.

 

1.Generation of T-con

 

The gold finger material Polymide is thin and flexible. Other areas material CCL FR4. 

 

2 . Specifications:

 

Name 12Layer Rigid-flex HDI pcb for Tcon LCM / Soft gold finger
Layers 12
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material Polymide + FR4
Min Track/Spacing 75um/100um
Drilling Size 100um
Solder Mask Green
Silkscreen White
Surface Finish Immersion gold
Finished Copper 1/3OZ
Production time 10-21 working days
Lead time 2-3 days
 

 

Quality Grade Standard IPC 2 Material DuPont PI, Domestic Shengyi PI
Number of Layers 1 - 8layers Board Size Min 6*6mm, Max 406*610mm
Order Quantity 1pc - 10000+pcs Board Thickness 0.1mm - 0.8mm
Build Time 2days - 5weeks Copper Weight (Finished) 0.5oz - 2.0oz
Min Tracing/Spacing 3mil/3mil Silkscreen Sides As per the file
Solder Mask Sides As per the file Silkscreen Color White, Black, Yellow
Solder Mask Color Green, White, Blue, Black, Red, Yellow Surface Finish

HASL - Hot air solder leveling

Lead - free HASL - RoHS

ENIG - RoHS

Immersion Tin - RoHS

OSP - RoHS

Solder-stop coating---Soldermask oil Green, White, Blue, Black, Red, Yellow
Solder-stop coating---Coverlay PI and PET film
Min Annular Ring 4mil
Min Drilling Hole Diameter 8mil
Min. hole size---Drilling (PTH) 0.2mil Other Techniques

Peelable solder mask

Gold fingers

Stiffener (only for PI/FR4 substrate)

Min. hole size---Punching (NPTH) 0.5mil
Tolerance of dimension ±0.05mm
 

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Company Topmatch Electronics (Suzhou) Co., Limited.
Location Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
Contact Person Jerry He

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