Hardware QSFP DD Pcb Board Production 8 Layer Plus 2 HDI Gold Finger 100G
QSFP-DD PCB board,8Layer Plus 2 HDI, gold finger,100G material
Temp-Flex cable technology
Boosts electrical performance
Provides excellent operational margin, short lead times and minimal end-user cost via manufacturing efficiencies
Meets IEEE 802.3bj, InfiniBand EDR and SAS 3.0 specifications
Functions across a wide variety of next-generation technologies and applications
Product application
Optical module
QSFP-DD(Quad Small Form-factor Pluggable-Double Density) has a four-channel SFP-DD interface, a single-channel transmission rate of 56Gbps, and a transmission rate of 100Gbps. It is applicable to high-performance switch, router, server and host bus adapter in calculation and telecom application, with enterprise storage, high density, high-speed I/O, and multi-channel interconnection.
Specifications:
| Name | QSFP-DD PCB board |
| Layers | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | Tachyon 100G |
| Thickness | 1.0mm |
| Min Track/Spacing | 75um/75um |
| Drilling Size | 0.15mm |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold + ENEPIG |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
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