Element TCon Board Or Fpc Cable 12um To 35um Copper
12Layer Rigid-flex HDI PCBA for Tcon LCM / Soft gold finger
The rigid-flex designs are made up of multiple layers of flexible substrates which are further integrated into one or more rigid boards internally or externally based on the design of the application.
The rigid-flex circuits are made in a 3D space; the reason you can roll, twist and turn flexible board substrates as you like better to achieve the required design.
They provide greater spatial efficiency which makes them more challenging to design than the making of regular rigid circuit boards. While a rigid portion of the board offers strength and toughness, the flexible material removes the weight and space issues by offering a spatial degree of freedom.
1.Generation of T-con
The gold finger material Polymide is thin and flexible. Other areas material CCL FR4.
2 . Specifications:
| Name | 12Layer Rigid-flex HDI pcb for Tcon LCM / Soft gold finger |
| Layers | 12 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | Polymide + FR4 |
| Min Track/Spacing | 75um/100um |
| Drilling Size | 100um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1/3OZ |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
| Quality Grade | Standard IPC 2 | Material | DuPont PI, Domestic Shengyi PI |
| Number of Layers | 1 - 8layers | Board Size | Min 6*6mm, Max 406*610mm |
| Order Quantity | 1pc - 10000+pcs | Board Thickness | 0.1mm - 0.8mm |
| Build Time | 2days - 5weeks | Copper Weight (Finished) | 0.5oz - 2.0oz |
| Min Tracing/Spacing | 3mil/3mil | Silkscreen Sides | As per the file |
| Solder Mask Sides | As per the file | Silkscreen Color | White, Black, Yellow |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow | Surface Finish |
HASL - Hot air solder leveling Lead - free HASL - RoHS ENIG - RoHS Immersion Tin - RoHS OSP - RoHS |
| Solder-stop coating---Soldermask oil | Green, White, Blue, Black, Red, Yellow | ||
| Solder-stop coating---Coverlay | PI and PET film | ||
| Min Annular Ring | 4mil | ||
| Min Drilling Hole Diameter | 8mil | ||
| Min. hole size---Drilling (PTH) | 0.2mil | Other Techniques |
Peelable solder mask Gold fingers Stiffener (only for PI/FR4 substrate) |
| Min. hole size---Punching (NPTH) | 0.5mil | ||
| Tolerance of dimension | ±0.05mm |
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