Antenna 5g Motherboards Electronic Pcb 8 Layer Hdi For Pos Terminal

Pcb 8 Layer Hdi Board For Pos Terminal Pcb Factory

Compared to 4G network, the fifth-generation mobile technology will offer 10-20 times higher transmission rates (up to 1 Gbps), up to 1000 times higher traffic density and 10 times higher connections per square kilometer. The 5G network also aims to provide 1 millisecond latency, 10 times faster than that available with the 4G network, operating on a much wider frequency range. PCBs will have to simultaneously support data rates and frequencies far higher than current ones, pushing mixed signal design to its limits. While 4G network operates with frequencies all below the 6 GHz threshold (from 600 MHz to 5.925 GHz), 5G network will move the upper frequency limit much higher, up to the millimeter wave region (mmWave) , with bands centered around the frequencies 26 GHz, 30 GHz and 77 GHz.

Printed circuit board, the heart of every electronic device, is important not only because it allows the electrical connections between the various components, but also because it carries digital and analog signals, high frequency data transmission signals and power supply lines. With the introduction of 5G technology, what will the new demands and requirements that PCBs have to meet? Compared to 4G, the imminent large-scale deployment of 5G network will force designers to rethink the design of PCBs for mobile, IoT and telecommunications devices. The 5G network will be characterized by high speed, wide bandwidth and low latency, all aspects that will require careful PCB design in order to support the new high-frequency features.

1. Product application

Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.

2 . Specifications:

PCBs for high frequency applications require to be subjected to automatic inspection procedures, both optical (AOI) or performed through ATE. These procedures allow to enormously increase the quality of the product, highlighting possible errors or inefficiencies of the circuit. The recent progress made in the field of automatic inspection and testing of PCBs has led to significant time savings and reduced costs associated with manual verification and testing. The use of new automated inspection techniques will help overcome the challenges imposed by 5G, including global impedance control in high frequency systems. Increased adoption of automated inspection methods also allows for consistent performance with high production rates.