Multilayer Quick Term HDI Printed Circuit Board & PCBA Rigid Flexible
Multilayer HDI Quick Term Printed Circuit Board &PCBA Rigid Flexible PCB
What are the advantages of HDI PCBs?
- Phenomenal versatility: HDI boards are ideal where weight, space, reliability, and performance are primary concerns.
- Compact design: The combination of blind vias, buried vias, and microvias brings down the board space requirement.
- Better signal integrity: HDI incorporates via-in-pad and blind via technology. This helps in placing the components closer to each other which cuts down the signal path length. The HDI technology removes via stubs and therefore reduces reflections of signal and thus improving signal quality. It therefore remarkably improves signal integrity due to shorter signal paths. Also read: Signal Integrity: Via Stubs and Their Effects on Signal Attenuation and Data Transfer Rates
- High reliability: The implementation of stacked vias make these boards a super shield against extreme environmental conditions.
- Cost-effective: The functionality of a standard 8-layer through-hole board (standard PCB) can be reduced to a 6-layer HDI board without compromising the quality.
Specifications:
| Technical Capacity | |||
| ltem | Rigid PCB | Flexible PCB | Rigid-Flex PCB |
| Max Layer | 24L | 8L | 20L |
| Inner Layer Min Trace/Space | 3/3mil | 3/3mil | 3/3mil |
| Out Layer Min Trace/Space | 3/3mil | 3.5/4mil | 3.5/4mil |
| Inner Layer Max Copper | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 6oz | 2oz | 3oz |
| Min Mechanical Driling | 0.15mm | 0.1mm | 0.15mm |
| Min Laser Drilling | 0.1mm | 0.1mm | 0.1mm |
| Max Aspect Ratio(Mechanical Driling) | 20:01 | 10:01 | 12:01 |
| Max Aspect Ratio(Laser Drilling) | 1:01 | / | 1:01 |
| Press Fit Hole Ttolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| PTH Tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
| NPTH Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| Countersink Tolerance | ±0.15mm | ±0.15mm | ±0.15mm |
| Board Thickness | 0.4-8mm | 0.1-0.5mm | 0.4-3mm |
| Board Thickness Tolerance(<1.0mm)<> | ±0.1mm | ±0.05mm | ±0.1mm |
| Board Thickness Tolerance(≥1.0mm) | ±10% | / | ±10% |
| Min Board Size | 10*10mm | 5*10mm | 10*10mm |
| Max Board Size | 620*1200mm | 480*540mm | 480*540mm |
| Contour Tolerance | ±0.1mm | ±0.05mm | ±0.1mm |
| Min BGA | 7mil | 7mil | 7mil |
| Min SMT | 7*10mil | 7*10mil | 7*10mil |
| Min Solder Mask Clearance | 1.5mil | 3mil | 1.5mil |
| Min Solder Mask Dam | 3mil | 8mil | 3mil |
| Min Legend Width/Height | 4/23mil | 4/23mil | 4/23mil |
| Strain Fillet Width | / | 1.5±0.5mm | 1.5±0.5mm |
| Bow &Twist | 0.70% | / | 0.70% |
Our advantage:
A. Very competitive price
B. Fast lead time from 12 hours
C. Perfect service and good relation ship with customer
D. Good quality. Welcome all kinds OEM ODM PCB order!
Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
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