Topmatch Electronics (Suzhou) Co., Limited.
                                                                                                           
Verified Supplier
27 Years
Since 1999
Menu

High Density HDI PCB Circuit Board Medical Assembly With Components

Price Negotiable
Price: Negotiation
MOQ: Negotiation
Delivery Time: 10-14working days
Brand: TOPCBS
Product Description

High Density HDI PCB Circuit Board Medical PCB & PCBA Motherboard PCB Assembly With Components​

 

HDI board is generally made by stacking, the more times the stacking, the higher the technical level of the board.

 

Ordinary HDI board is basically one stacking. The high level HDI uses two or more laminar structure of technology. At the same time, the use of stacking holes, electroplating hole filling, laser direct drilling and other advanced PCB technology. When PCB density increases beyond eight layers, the cost of manufacturing with HDI is lower than that of traditional complex laminating processes.

 

The electrical performance and signal accuracy of HDI board are higher than traditional PCB. In addition, HDI board for radio frequency interference, electromagnetic interference, electrostatic release, heat conduction and other better improvement. High density integration (HDI) technology enables end product designs to be miniaturized while meeting higher standards of electronic performance and efficiency.

 

1 . Descriptions:

 

What is a HDI PCB?

 

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.


Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.


Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

 

2 . Specifications:

Model Number: Pcb & PCB assembly
Base Material: FR-4,Hi-TG FR4,CEM-1,CEM-3
Copper Thickness: 0.3oz-6oz
Board Thickness: 0.4mm-12mm
Min. Hole Size: 0.1mm
Min. Line Width: 2.5mil
Min. Line Spacing: 2.5mil
Surface Finishing: HASL, ENIG, OSP, HASL LEAD FREE, ENEPING, IMMERSION SILVER, IMMERSION TIN, GOLD FINGER, PLATING HARD GOLD, BLUE MASK SOLDER,
Layer No. 1-48L Layers
PCB Test: Flying probe and AOI (Default)/Fixture Test
Base, Cover film, Stiffeners thickness:: 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
BGA Ball Pitch: 1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly Method: SMT, Through-hole, Mixed, BGA
PCB Assembly Test: Visual Inspection (default), AOI, FCT, X-RAY
Hi-TG FR4 Material: Tg-130 Tg-140 Tg-160 Tg-170
Electrical Testing: Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard: IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need
Special requirements: Buried and blind vias, Impedance control, via plug, BGA soldering etc.
Supply Ability 500000 Square Meter/Square Meters per Month No MOQ
Packaging & Delivery 1.Inner: Vacuum packing or Anti-static package; 2.Outer: Standard export carton; 3.Customized package.
Wireless ECG Electrodes PCB PCBA Assembly Manufacturer

 

 

3. Advantages:

 

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

 

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Topmatch Electronics (Suzhou) Co., Limited.
Location Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
Contact Person Jerry He

Request A Quote

Please check your email address.
Your message must be at least 20 characters.