Industrial HDPE UV Laser Cutting Machine 1200W 355nm with 8000mm/s Scan Speed and IP65 Rating
Price:
US $ 14000-20000 per set
MOQ:
1
Delivery Time:
5-8 working days
Brand:
DIKAI
Product Description
Industrial HDPE UV Laser Cutting Machine Overview
The DLU500 UV Laser Cutting Machine delivers high-precision marking and cutting capabilities for industrial plastic film production lines. Utilizing 355nm wavelength UV laser technology, this system provides permanent, high-contrast marking ideal for product tracking, anti-counterfeiting, and supply chain management.
Key Features & Benefits
High Speed & Quality Performance
- Up to 700 characters per second marking speed
- New intelligent vector control algorithm
- Enhanced anti-electromagnetic interference design for stable operation in harsh environments
Easy Installation & Integration
- Compact 85cm×44cm×31cm design for space-constrained installations
- Unique integration-friendly configuration
Permanent Identification Solutions
- Virtually unlimited fonts, graphics, and barcode options
- Permanent marking ensures product tracking, anti-counterfeiting, and anti-channelization
Low Maintenance Operation
- MTBF exceeding 20,000 hours
- Non-consumable design for significant cost savings
- One-button startup with intuitive interface
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | DLU500i |
| Laser Type | UV Laser |
| Wavelength | 355nm |
| Output Power | 5W |
| Marking Area | 70×70mm to 800×800mm (optional) |
| Scan Speed | ≤8000mm/s |
| Focal Distance | 135mm to 1250mm (optional) |
| Power Supply | 110-220V, 50-60Hz |
| Power Consumption | 600W |
| Working Temperature | 10-30℃ |
| IP Rating | IP54, IP65 optional |
| Weight | 20.8kg (laser), 24kg (cooling) |
Applications
Ideal for HDPE, LDPE, and other plastic materials used in food packaging, pipes, chemical products, pharmaceutical packaging, medical devices, and cosmetic industries. Suitable for ultra-fine marking, micro-drilling, glass division, and silicon wafer cutting.
Technology Advantage
The 355nm UV laser technology minimizes mechanical deformation and thermal influence, providing superior marking quality compared to infrared lasers. The photochemical processing method enables deep material penetration for permanent, high-contrast identification.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shanghai Dikai Coding Technology Co., Ltd
Location
Building No.1, SCI-TECH ONE, No. 489 Wenchuan Road, Baoshan District, Shanghai 201906,P.R.C.
Contact Person
Julie