133OD*125ID*2940L Include Flange Titanium Tube Target Titanium Gr2 ASTM B861-06 a The Target Material Vacuum Coating

The technological development trend of target materials is closely related to the development trend of film technology in downstream application industries. With the technological improvement of film products or components in application industries, target technology should also change accordingly. Among all the application industries, the semiconductor industry has the most demanding quality requirements for target sputtering films. Today 12-inch silicon wafers are manufactured. The width of the interconnects is decreasing. Wafer manufacturers require large size, high purity, low segregation and fine grains for the target, which requires the target to have a better microstructure. The crystal particle diameter and uniformity of the target have been considered as the key factors affecting the deposition rate of the film. Flat panel display (FPD) has greatly impacted the cathode ray tube (CRT) -based computer monitor and TELEVISION market in recent years, and will also drive ITO target technology and market demand. ITO targets today come in two varieties. One is to mix nano-state indium oxide and tin oxide powder and then sintered, the other is to use indium tin alloy target. ITO films can be made from indium tin alloy target by direct current reactive sputtering, but the sputtering rate will be affected by the oxidation of the target surface, and it is not easy to get large size platymetal target. In terms of storage technology, the development of high-density and large-capacity hard disks requires a large number of giant reluctance film materials. CoF~Cu multilayer composite film is a widely used giant reluctance film structure.

Main advantages
Low density high specification strength
Custom request customization
Excellent corrosion resistance
Good heat resistance
Excellent low temperature performance
Good thermal properties
Low elastic modulus